QianLi L256 iStele Dual-Spectral 3D Infrared Thermal Imaging Analyzing Camera

QianLi L256 iStele Dual-Spectral 3D Infrared Thermal Imaging Analyzing Camera

The QianLi L256 iStele Dual-Spectral Thermal Camera is a powerful, compact diagnostic tool designed for electronics repair technicians, mobile/laptop-board repair shops, and QC labs. It combines high-resolution thermal imaging with visible-light overlay in a foldable, portable form — making it easy to attach to benches or microscopes for precise work.

With its 256×192 VOx thermal sensor and 8–14 µm spectral range, L256 iStele captures detailed heat maps of PCBs, chips or electronic circuits, enabling you to detect overheating components, short circuits, soldering issues, or leaking currents — which are often invisible under a standard microscope or magnifier.

The camera also offers a dual-mode imaging system: switch effortlessly between thermal only, visible-light only, or overlay/edge-enhanced dual-spectral views. This makes fault diagnosis faster and more intuitive — especially helpful when dealing with complex motherboards or multi-layer PCBs.

Compact, USB-C powered and energy-efficient (power draw < 250 mW), the L256 iStele is designed for frequent use in repair benches, R&D labs, or field service — offering real-time thermal imaging as you test circuits, apply power, or rework components.

Whether you’re troubleshooting a smartphone board, diagnosing power supply faults, inspecting battery or charger components, or performing BGA/IC work — the QianLi L256 gives you an extra layer of insight and precision, speeding up diagnostics and reducing the risk of damage.

🔧 Key Features

• 256×192 VOx thermal sensor — produces detailed thermal maps for heat-fault detection, shorts, and component overheating.
• Dual-Spectral Imaging: Thermal + Visible Light + Overlay Modes — view thermal map, visible image, or both combined for accurate inspection.
• Wide Field of View (56° × 42°) — covers larger board areas — useful for motherboards, multi-layer PCBs, or large circuitry.
• Compact, foldable & portable design — easy to mount on benches or microscopes; convenient for mobile repair work or space-constrained workstations.
• USB-C interface & low power consumption (<250 mW) — plug-and-play connectivity, no bulky power setup needed.
• Full-scale temperature measurement (0 °C–120 °C) — suitable for typical electronics/components temperature ranges and thermal diagnostics.
• Quick-Check & One-Click Fault Detection Mode — rapidly locates hotspots or faults on PCBs with minimal configuration, perfect for quick diagnostics.
• Photo (JPG) & Video (MP4) capture — record thermal/visible overlays, useful for documentation, troubleshooting or sharing with clients/colleagues.
• Versatile Application – PCBs, Motherboards, Batteries, Power Circuits & More — suitable for smartphone repair, laptop repair, battery testing, QC inspection, and lab diagnostics.
• Temperature Inspection Distance from ~2 mm to ∞ — enables close-up component-level checks as well as board-level scans.

📐 Technical Specifications